Reconfiguring through silicon vias in stacked multi-die packages

ABSTRACT

Through silicon vias (TSVs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. TSV connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die. TSV connections to the inputs and/or outputs of a die&#39;s native circuitry may be changed. A die may be disconnected altogether from an interface that interconnects dice in the stack, or a die that was originally disconnected from such an interface may be connected to the interface.

This application claims priority under 35 USC 119 to U.S. ProvisionalApplication No. 61/252,865, which was filed on Oct. 19, 2009 and isincorporated herein by reference.

FIELD

The present work relates to semiconductor integrated circuit devicesand, more particularly, to packaged arrangements of multiple integratedcircuit dice in a stacked configuration, interconnected by throughsilicon vias (TSVs).

BACKGROUND

Conventional technology provides for stacked multi-die packages withadjacent dice interconnected by TSVs. A number of spare TSVs may beprovided on each die for redundancy purposes, thereby permittingreplacement of any faulty TSVs that may be identified duringmanufacturing. After the initial manufacturing process has beencompleted, the spare TSVs on the die are not used.

It is therefore desirable to provide for utilizing spare TSVs in stackedmulti-die packages.

SUMMARY

It is therefore an object of the invention to provide apparatus,methods, and systems for utilizing spare TSVs in stacked multi-diepackages.

According to a broad aspect of the invention there is provided anintegrated circuit die apparatus, including a plurality of viasextending through the apparatus for providing external access to signalson the apparatus; and a router coupled to said vias, said routerconfigured to cause said vias to assume a selected one of a plurality ofsignal-carrying configurations; wherein, in said selectedsignal-carrying configuration, at least one of said vias carries anassociated at least one signal that said at least one via does not carryin another of said signal-carrying configurations.

Preferably, at least another of said vias carries the associated atleast one signal in said another of said signal-carrying configurations.

Beneficially, the apparatus includes a controller coupled to said routerfor providing thereto a control signal indicative of said selectedsignal-carrying configuration.

Additionally, said controller is configured to receive informationindicative of said selected signal-carrying configuration, and toprovide said control signal in response to said information.

Conveniently, said controller is coupled to a group of said vias toreceive said information from a source external to the apparatus viasaid group of vias.

Preferably, said router is configured to route said information fromsaid group of vias to said controller.

Conveniently, the external source is a further integrated circuit dieapparatus having a further plurality of vias extending therethrough forproviding external access to signals on the further apparatus.

Additionally, said group of vias is adapted for connection to a furthergroup of the further plurality of vias to receive said information.

Beneficially, said controller is adapted to receive said informationfrom an external controller that selects said selected signal-carryingconfiguration.

Gainfully, said controller includes a register for storing said controlsignal.

Additionally, a group of said vias is coupled to said controller totransfer, from said controller to a further controller of a furtherintegrated circuit die apparatus, information indicative of a selectedone of a plurality of signal-carrying configurations assumable by afurther plurality of vias that extend through the further apparatus andprovide external access to signals on the further apparatus.

Preferably, the apparatus includes native circuitry coupled to saidrouter and wherein, in respective ones of said signal-carryingconfigurations, said router routes respective signals from respectiveportions of said native circuitry to a same one of said vias.

According to another broad aspect of the invention there is provided amethod of integrated circuit die operation, including causing aplurality of vias that extend through the die and provide externalaccess to signals on the die to assume a first signal-carryingconfiguration; and causing the plurality of vias to assume a secondsignal-carrying configuration; wherein, in the first signal-carryingconfiguration, at least one of the vias carries an associated at leastone signal that the at least one via does not carry in the secondsignal-carrying configuration.

Preferably, the first and second signal-carrying configurationsrespectively route signals from respective portions of native circuitryon the die to a same one of the vias.

According to still another broad aspect of the invention there isprovided a stacked integrated circuit apparatus, including a pluralityof integrated circuit die apparatus, each said integrated circuit dieapparatus including a plurality of vias extending therethrough forproviding external access to signals on the integrated circuit dieapparatus, said plurality of integrated circuit die apparatus arrangedin a stack such that the vias of each said integrated circuit dieapparatus are respectively connected to the vias of an adjacentintegrated circuit die apparatus; and each said integrated circuit dieapparatus including a router coupled to the associated vias andconfigured to cause the associated vias to assume a signaling connectionconfiguration in which native circuitry of the associated integratedcircuit die apparatus is connected by selected ones of the associatedvias for signaling with an adjacent said integrated circuit dieapparatus, each said router further configured to cause the associatedvias to assume a signaling disconnect configuration in which the nativecircuitry of the associated integrated circuit die apparatus is notconnected for signaling with the adjacent integrated circuit dieapparatus.

Preferably, the apparatus includes a packaging substrate coupled to onesaid integrated circuit die apparatus.

According to yet another broad aspect of the invention there is provideda stacked integrated circuit apparatus, including a plurality ofintegrated circuit die apparatus; each said integrated circuit dieapparatus including a plurality of vias extending therethrough forproviding external access to signals on the integrated circuit dieapparatus, said plurality of integrated circuit die apparatus arrangedin a stack such that the vias of each said integrated circuit dieapparatus are respectively connected to the vias of an adjacentintegrated circuit die apparatus, each said integrated circuit dieapparatus including a router coupled to the associated vias andconfigured to cause the associated vias to assume a selected one of aplurality of signal-carrying configurations wherein, in said selectedsignal-carrying configuration, at least one of the associated viascarries an associated at least one signal that said at least one viadoes not carry in another of said signal-carrying configurations.

Preferably, the apparatus includes a packaging substrate coupled to onesaid integrated circuit die apparatus.

According to another broad aspect of the invention there is provided amethod of operating a plurality of stacked integrated circuit dieapparatus wherein each integrated circuit die apparatus includes aplurality of vias extending therethrough for providing external accessto signals on the integrated circuit die apparatus, and in which thevias of each said integrated circuit die apparatus are respectivelyconnected to the vias of an adjacent integrated circuit die apparatus,the method including: causing the vias of one integrated circuit dieapparatus to assume a signaling connection configuration in which nativecircuitry of the one integrated circuit die apparatus is connected byselected ones of the vias for signaling with an adjacent said integratedcircuit die apparatus; and causing the vias of the one integratedcircuit die apparatus to assume a signaling disconnect configuration inwhich the native circuitry of the one integrated circuit die apparatusis not connected for signaling with the adjacent integrated circuit dieapparatus.

Beneficially, said first-mentioned causing results in connection of onesaid integrated circuit die apparatus into an interface thatinterconnects at least some of the remaining said integrated circuit dieapparatus and from which said one integrated circuit die apparatus wasdisconnected before said first-mentioned causing.

Conveniently, said second-mentioned causing results in disconnection ofone of said at least some of the remaining integrated circuit dieapparatus from said interface.

Preferably, said last-mentioned causing results in disconnection of onesaid integrated circuit die apparatus from an interface thatinterconnects at least some of the remaining said integrated circuit dieapparatus.

According to another broad aspect of the invention there is provided asystem, including a stacked integrated circuit apparatus, including aplurality of integrated circuit die apparatus, each said integratedcircuit die apparatus including a plurality of vias extendingtherethrough for providing external access to signals on the integratedcircuit die apparatus, said plurality of integrated circuit dieapparatus arranged in a stack such that the vias of each said integratedcircuit die apparatus are respectively connected to the vias of anadjacent integrated circuit die apparatus, each said integrated circuitdie apparatus including a router coupled to the associated vias andconfigured to cause the associated vias to assume a selected one of aplurality of signal-carrying configurations wherein, in said selectedsignal-carrying configuration, at least one of the associated viascarries an associated at least one signal that said at least one viadoes not carry in another of said signal-carrying configurations; andelectronic circuitry provided externally of said stacked integratedcircuit apparatus and coupled thereto for communication therewith.

Preferably, said stacked integrated circuit apparatus implements one ofdata processing functionality and data storage functionality, and saidelectronic circuitry is cooperable with said one of data processingfunctionality and data storage functionality.

According to yet another aspect of the invention there is provided asystem, including a stacked integrated circuit apparatus, including aplurality of integrated circuit die apparatus, each said integratedcircuit die apparatus including a plurality of vias extendingtherethrough for providing external access to signals on the integratedcircuit die apparatus, said plurality of integrated circuit dieapparatus arranged in a stack such that the vias of each said integratedcircuit die apparatus are respectively connected to the vias of anadjacent integrated circuit die apparatus, each said integrated circuitdie apparatus including a router coupled to the associated vias andconfigured to cause the associated vias to assume a signaling connectionconfiguration in which native circuitry of the associated integratedcircuit die apparatus is connected by selected ones of the associatedvias for signaling with an adjacent said integrated circuit dieapparatus, each said router further configured to cause the associatedvias to assume a signaling disconnect configuration in which the nativecircuitry of the associated integrated circuit die apparatus is notconnected for signaling with the adjacent integrated circuit dieapparatus; and electronic circuitry provided externally of said stackedintegrated circuit apparatus and coupled thereto for communicationtherewith.

Beneficially, said stacked integrated circuit apparatus implements oneof data processing functionality and data storage functionality, andsaid electronic circuitry is cooperable with said one of data processingfunctionality and data storage functionality.

It should be noted that for the purpose of this disclosure a routerincludes a switch, a multiplexer, or any other means known in the artfor selectively connecting any one of a plurality of inputs to an outputport.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 diagrammatically illustrates a stacked multi-die packageapparatus according to example embodiments of the present work.

FIG. 2 diagrammatically illustrates a TSV router of FIG. 1 in moredetail according to example embodiments of the present work.

FIG. 3 diagrammatically illustrates communication links between TSVrouter controllers within dice of a stacked multi-die package apparatusaccording to example embodiments of the present work.

FIG. 4 diagrammatically illustrates examples of TSV reallocationssupported by a stacked multi-die package apparatus according to exampleembodiments of the present work.

FIGS. 5 a and 5 b are timing diagrams of signaling operationsrespectively associated with reading and writing registers in TSV routercontrollers of a stacked multi-die package apparatus according toexample embodiments of the present work.

FIG. 6 diagrammatically illustrates in more detail slave dice within astacked multi-die package apparatus according to example embodiments ofthe present work.

FIGS. 7 a, 7 b, 7 c, and 8 a-8 b diagrammatically illustrate examples ofreconfigurations of die-level connections in a stacked multi-die packageapparatus according to example embodiments of the present work.

FIG. 9 diagrammatically illustrates a system including a stackedmulti-die package apparatus according to example embodiments of thepresent work.

DETAILED DESCRIPTION

Example embodiments of the present work provide for causing TSVs in astacked multi-die package to assume different connection configurationsas desired using a router that may be controlled by a programmableregister. In various embodiments, connections among the dice or betweena die and a substrate are reconfigured. By changing the value stored inthe register, a user may, during field operation of the package in itsnormal mission mode, connect the affected die in a manner differentfrom, for example, a factory default connection. As examples, TSVconnections to the I/O (inputs and/or outputs) of a die's nativecircuitry may be changed, a die may be disconnected altogether from thestack, or a die that was originally disconnected from the stack in thefactory default configuration may be connected.

FIG. 1 diagrammatically illustrates a multi-chip package containingstacked integrated circuit dice according to example embodiments of thepresent work. A master die 11 is connected to the package's externalterminals (e.g., package leads). One or more slave dice may be stackedatop the master die 11. (Although the physical stack is not explicitlyshown in the diagrammatic representation of FIG. 1, it will beunderstood by workers in the art.) FIG. 1 shows explicitly a slave die12 which would be positioned in the stack physically opposite the masterdie 11. Intervening stacked slave dice 12 are designated collectively at12A. The broken line 100 represents connections between TSVs of themaster die 11 and respective axially aligned TSVs of the slave dieadjacent master die 11. The broken line 101 represents connectionsbetween TSVs of the slave die 12 and respective axially aligned TSVs ofthe slave die adjacent slave die 12. TSV connections between adjacentones of the intervening stacked slave dice at 12A are not explicitlyshown. It is known in the art to package a stack of integrated circuitdice with respective axially aligned TSVs of each pair of adjacent diceelectrically connected to one another.

Typically, a number of TSVs are fabricated on each die and extendthrough the die for connecting to TSVs of adjacent die on respectivelyopposite sides of the die. A subset of the TSVs is selected by designfor connecting signals and/or power between the dice in a stack. Exampleembodiments of the present work take advantage of the remaining (spare)TSVs that were neither allocated for use in the chip design nor used toreplace faulty TSVs. These spare TSVs are made available forestablishing different connection configurations at a future time.

Master die 11 in FIG. 1 is connected to the external terminals of thepackaged multi-die stack via a package substrate 13 (a printed circuitboard in some embodiments). Master die 11 includes TSVs 18, a TSV router14, a TSV router controller 15, and native circuitry that implements thenormal functionality of the master die 11. The slave die 12 includesTSVs 19, a TSV router 14, a TSV router controller 17, and its own nativecircuitry.

FIG. 2 diagrammatically illustrates the TSV router 14 in more detailaccording to exemplary embodiments of the present work. The router 14includes a default port connected to those TSVs of the die that havebeen assigned by the chip design to carry the signals and power requiredfor the intended operation of the stacked multi-die package. These TSVsare also referred to herein as default TSVs. The design may alsoallocate default TSVs to transfer signals and/or power through the diefor use by adjacent dice on opposite sides of the die. The router 14further includes a native circuitry port for interfacing with the nativecircuitry of the die. In the initial default configuration of the die asoriginally manufactured, the router 14 implements appropriateconnections between the default port and the native circuitry port toconnect default TSVs to the native circuitry as desired.

It should be noted that for the purpose of this disclosure a routerincludes a switch, a multiplexer, or any other means known in the artfor selectively connecting any one of a plurality of inputs to an outputport.

Heretofore, the remaining spare TSVs have not been used except duringthe initial manufacturing process, when they are available forredundancy purposes to replace faulty TSVs identified during themanufacturing process. According to the present work, the router 14includes a reallocation port connected to the spare TSVs. These spareTSVs are thus available for use in reconfiguring connections, and/orconfiguring new connections, within the stacked multi-die package duringfield operation of the package in its normal mission mode.

FIG. 2 also illustrates that, in various embodiments, the routercontroller (see also 15 and 17 in FIG. 1) may be connected to defaultTSVs of the associated die via the router 14 (see broken lines), or by adedicated connection 21. Programmable registers in the controller may beaccessed via TSVs and used to control router 14, via a controlconnection at 22, to allocate spare TSVs for reconnecting ordisconnecting signals that are already otherwise connected, or formaking new connections that did not previously exist.

FIG. 3 shows a master die 11 and several slave dice 12 (also designatedas slave dice 1-n) whose router controllers are interconnected via adedicated link that includes TSVs of the interconnected dice. In someembodiments, the dedicated link may be of the form of respectiveseparate connections from the master controller 15 to each slavecontroller 17. This is indicated by the broken line connections in FIG.3. In some embodiments, a single parallel link connects the mastercontroller to all slave controllers on a shared bus 31. In the brokenline embodiments with separate controller interconnections, the mastercontroller 15 has a number of separate ports, one for each slavecontroller 17. Accordingly, these embodiments accommodate only thatnumber of slave dice. On the other hand, the shared bus embodimentsaccommodate as many slave dice as there are addresses to identify slavedice. Thus, the number of slave dice that may be supported depends onlyon the width of the device address field supported by the shared bus 31.

Some embodiments reallocate TSVs of a die by programming one or moreregisters of the associated router controller with specific values thatcorrespond to breaking existing connections and/or making newconnections. Generally, the user programs the connection values into theregisters of the router controller of a die (e.g., the master) in thestack which, in turn, affects the corresponding registers in the otherdice in the stack. In this way, the TSV connection configurations amongall dice in the stack may be coordinated.

Referring again to FIG. 3, in some embodiments, the user employs adesignated command to reprogram the appropriate router controllerregister(s) on the master die 11, which is connected to the externalpackage leads at 103 to receive the user command from an externalcontroller 102 (see also FIG. 1). In some embodiments, the connection at103 is made via TSVs of the master die 11, the package substrate and theexternal package terminals. On the master die, the native circuitry hasa port 38 to the router controller 15, and is used for read/write accessto the registers therein. In some embodiments, the TSV controller 15uses the TSV router controller link (e.g., shared bus 31) to copy itsnewly written register values (or corresponding values needed for thedesired TSV configuration) to the router controller registers of anyslave die (or dice) involved in the desired reconfiguration of TSVconnections. The router controller 15 of the master die 11 determines,from information contained in the command, the appropriate values thatshould be written to its registers and those of the affected slave dicecontrollers 17 to realize the desired TSV configuration for the stack.

FIG. 4 shows reconfiguration of existing connections according toexample embodiments of the present work. The top part of FIG. 4 shows astack of dice having a subset (shown by darkened in-service TSV lines inFIG. 4) of the total available TSVs in service at the time ofmanufacturing. At some time during use in mission mode, spare TSVconnections of the die stack may be reconfigured to use TSVs other thanthe original in-service TSVs (as shown by the different darkenedin-service TSV lines) in the bottom part of FIG. 4. In general, acommand is issued to program registers of one or more of the routercontrollers, which then causes the associated TSV router(s) to reassignthe associated connections. This is done in some embodiments with aunique command such as depicted in FIG. 5. The command has the requisitedevice address (DA) and command information (CMD). In some embodiments,registers may be read as described below relative to FIG. 5 a, orwritten as described below relative to FIG. 5 b. For register write(programming) operations, some embodiments supply the register addressand its corresponding write data in pairs. By supplying the targetregister address as well as the data, the controller does not have toissue the correct data for all fields in the register group as isrequired for other writable register types. Thus, the controller avoidsoverhead such as maintaining a map of all existing register values, orfirst reading the register values for subsequent reprogramming.

FIG. 5 a shows a command that is used to read the TSV allocationregisters according to example embodiments of the present work. In someembodiments, the command packet follows a conventional protocol.Specifically, with CSI (command strobe input) high, the device address,followed by the command byte, and register address byte[s] are drivenonto the bus (e.g., shared bus 31 of FIG. 3), thereby priming the targetdevice to read the TSV allocation registers beginning with the registerat the address given in the command packet.

After a predetermined time (often referred to as t_(CDS) in typicaldevice data sheets) elapses, the controller asserts DSI (data strobeinput) which signals the target device to drive the bus with currentregister data, beginning at the address specified in the command packet.The target device internally increments its address pointer and drivesout data from successive register addresses for as long as DSI is highor until the end of the register address space is reached. Thisconstitutes the die's response to the command, shown by the bus activityafter DSI assertion.

FIG. 5 b shows a command packet that is used to change the allocation ofTSVs in a multi-chip package according to example embodiments of thepresent work. In some embodiments, the command packet generally followsthe conventional protocol illustrated by FIG. 5 a, and contains a deviceaddress, followed by a command byte, followed by address/databyte-pairs. Register addresses and corresponding data are provided inpairs, and may each be one byte or more in length in variousembodiments. These details depend on the device design parameters andwould be specified in the device data sheets. For example, devices withmore TSVs may require address and data fields that are longer in bytecount than devices that utilize fewer TSVs. Each address field refers toa unique register in the collection of allocation registers whichcontains information about the allocation of signals to TSVs. The dataprovided in the command packet data field over-writes the data in thespecified allocation register and, thereby, implements a new TSV/signalallocation.

Example embodiments for connecting previously unconnected native diecircuitry are illustrated diagrammatically in FIG. 6. TSVs may be usedto connect into the stack package sub-circuits (designated generally asCct1-Cctn) that were not connected in the default manufacturingconfiguration, or to disconnect from the stack package selectedsub-circuits that were connected in the default manufacturingconfiguration.

FIG. 7 diagrammatically illustrates adding/removing a die from a stack,or adding/removing a die from a ring architecture according to exampleembodiments of the present work. As an example, a stacked memory packagemay have one of its dice removed from the memory interface or ringarchitecture, or it may contain “spare” dice that can be added to theinterface/ring at a future time. Die 0 in FIG. 7 may be a master die 11,with the remaining dice (Die 1-Die 3) being slave dice 12. FIG. 7 showssituations wherein a top (FIG. 7 b) or intermediate (FIG. 7 c) die isremoved from the interface/ring configuration of FIG. 7 a. In someembodiments, the user operates external controller 102 (see also FIGS. 1and 3) to issue a suitable command that causes the TSV router of theaffected die to change the die's current TSV configuration bydisconnecting from the native circuitry of the die selected ones of thedie's TSVs that are connected to the native circuitry in the currentconfiguration. In some embodiments, the external controller 102 issuesthe command automatically in response to the OS (operating system) orcontroller microcode detecting a predetermined condition in the package.

FIG. 8 a shows a device stack according to example embodiments of thepresent work that contains a “spare” die (die 3) which may beselectively connected either by the user or by automaticsoftware/hardware control. An example application is in a multi-chippackage flash memory device that contains one or more spare flash dice.If more memory capacity is required, a spare die may be added into theinterface/ring as shown in FIG. 8 b. As another example, when one die inFIG. 8 a fails, it may be removed and replaced with a spare die, therebyultimately arriving at the configuration shown in FIG. 7 c, andextending the useful life of the multi-chip package. In variousembodiments, the die replacement process may be triggered by an errorreaching some threshold on a particular die, by failure of apredetermined number of sub-circuits in the native circuitry on the die,or by failure of a specific sub-circuit. When the condition is detected,a suitable command (or commands) cause the TSV router controllers of thespare die and the failed die to participate in execution of a suitableremedial procedure, for example: (1) connect the spare die into theinterface/ring; (2) transfer data from the failed die to the spare die;and (3) disconnect the failed die from the interface/ring.

FIG. 9 diagrammatically illustrates a system according to exampleembodiments of the present work. A multi-die stack package 91, forexample a package such as described above relative of FIGS. 1-8 b, iscoupled for communication with external electronic circuitry 92. In someembodiments, the package 91 implements data storage functionality, forexample, flash memory functionality. In some embodiments, the package 91implements any desired application specific functionality, for example,digital data processing. In various embodiments, the electroniccircuitry 92 may be any collection of circuitry that utilizes and/orcontrols the functionality implemented by the package 91, for example, amemory controller cooperable with data storage functionality implementedby the package 91, and may implement the functionality of controller 102as described above with respect to FIGS. 1-8.

Although example embodiments have been described above in detail, thisdoes not limit the scope of the invention, which can be practiced in avariety of embodiments.

What is claimed is:
 1. A stacked integrated circuit apparatus,comprising: a plurality of integrated circuit dice connected in a ringtopology, each die including: a plurality of vias extending through thedie for providing external access to signals on the die, said pluralityof dice being arranged in a stack such that the vias of each die areconnected to the vias of an adjacent die to form a serial connectionbetween adjacent dice; and a router coupled to the associated vias andconfigured to: cause the associated vias to assume a signalingconnection configuration in which native circuitry of the die isconnected by selected ones of the associated vias for signaling with anadjacent die; and cause the associated vias to assume a signalingdisconnect configuration in which the native circuitry of the die is notconnected for signaling with the adjacent die.
 2. The stacked integratedcircuit apparatus of claim 1, including native circuitry coupled to saidrouter and wherein, in respective ones of said signaling configurations,said router routes respective signals from respective portions of saidnative circuitry to a same one of said vias.
 3. The stacked integratedcircuit apparatus of claim 1, including a packaging substrate coupled toone of the dice.
 4. The stacked integrated circuit apparatus of claim 1,each die further including a controller coupled to said router forproviding thereto a control signal indicative of the assumed signalingconfiguration of the associated vias.
 5. The stacked integrated circuitapparatus of claim 4, wherein said controller includes a register forstoring said control signal.
 6. The stacked integrated circuit apparatusof claim 4, wherein a first group of said plurality of vias is coupledto said controller to transfer, from said controller to a secondcontroller of the adjacent integrated circuit die, informationindicative of a selected one of a plurality of signal-carryingconfigurations assumable by a second plurality of vias that extendthrough the adjacent integrated circuit die and provide external accessto signals on the adjacent die.
 7. The stacked integrated circuitapparatus of claim 4, wherein said controller is configured to receiveinformation indicative of the assumed signaling configuration, and toprovide said control signal in response to said information.
 8. Thestacked integrated circuit apparatus of claim 7, wherein said controlleris adapted to receive said information from an external controller thatselects the assumed signaling configuration.
 9. The stacked integratedcircuit apparatus of claim 7, wherein said controller is coupled to afirst group of said plurality of vias to receive said information from asecond group of vias of the adjacent die through said first group ofvias.
 10. The stacked integrated circuit apparatus of claim 9, whereinsaid router is configured to route said information from said firstgroup of vias to said controller.
 11. A system, comprising: a stackedintegrated circuit apparatus according to claim 1; and electroniccircuitry provided externally of said stacked integrated circuitapparatus and coupled thereto for communication therewith.
 12. Thesystem of claim 11, wherein said stacked integrated circuit apparatusimplements one of data processing functionality and data storagefunctionality, and said electronic circuitry is cooperable with said oneof data processing functionality and data storage functionality.